Aqueous compositions based on nanosized silica particles for chemical-mechanical polishing of silicon wafers

The method of preparation of suspensions based on nano-sized particles of fumed silica is described. The process and results of chemical-mechanical polishing of silicon wafers carried out in industrial environments are investigated. Recommendations on the use of polishing compositions in the chemical-mechanical polishing are making. When using the polishing suspensions SPS-81M and SPS-55M in the process of single-crystal silicon wafer CMP, high structural perfection and atomic smoothness of the surface roughness are achieved at the level of tenths of a nanometer.