Abstract:
This work considers the effect of vacuum annealing on the thermoelectric properties of Sb0.9Bi1.1Te2.9Se0.1 thin film and Sb0.9Bi1.1Te2.9Se0.1–С composites with various carbon contents produced by ion-beam deposition in an argon atmosphere. The electrical resistivity and the thermopower of Sb0.9Bi1.1Te2.9Se0.1–С nanocomposites are found to be dependent on not only the carbon concentration but also the type and the concentration of intrinsic point defects of the Sb0.9Bi1.1Te2.9Se0.1 solid solution, which determine the type of conductivity of Sb0.9Bi1.1Te2.9Se0.1 granules. The power factors are estimated for films of Sb0.9Bi1.1Te2.9Se0.1 solid solution and films of Sb0.9Bi1.1Te2.9Se0.1–С composites and found to have values comparable with the values for nanostructured materials on the basis of (Bi,Sb)2(Te,Se)3. solid solutions.
Citation:
Yu. E. Kalinin, M. A. Kashirin, V. A. Makagonov, S. Yu. Pankov, A. V. Sitnikov, “Effect of heat treatment on the structure and the thermoelectric properties of Sb0.9Bi1.1Te2.9Se0.1 thin films and composites based on them”, Fizika Tverdogo Tela, 59:1 (2017), 23–29; Phys. Solid State, 59:1 (2017), 21–27
\Bibitem{KalKasMak17}
\by Yu.~E.~Kalinin, M.~A.~Kashirin, V.~A.~Makagonov, S.~Yu.~Pankov, A.~V.~Sitnikov
\paper Effect of heat treatment on the structure and the thermoelectric properties of Sb$_{0.9}$Bi$_{1.1}$Te$_{2.9}$Se$_{0.1}$ thin films and composites based on them
\jour Fizika Tverdogo Tela
\yr 2017
\vol 59
\issue 1
\pages 23--29
\mathnet{http://mi.mathnet.ru/ftt9701}
\crossref{https://doi.org/10.21883/FTT.2017.01.43945.206}
\elib{https://elibrary.ru/item.asp?id=28969424}
\transl
\jour Phys. Solid State
\yr 2017
\vol 59
\issue 1
\pages 21--27
\crossref{https://doi.org/10.1134/S1063783417010115}
Linking options:
https://www.mathnet.ru/eng/ftt9701
https://www.mathnet.ru/eng/ftt/v59/i1/p23
This publication is cited in the following 1 articles:
M. N. Yapryntsev, A. E. Vasil'ev, O. N. Ivanov, “Influence of the sintering temperature on the thermoelectric properties of the Bi1.9Gd0.1Te3 compound”, Semiconductors, 53:5 (2019), 615–619