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Modeling of the kinetics of reactive diffusion of gallium in copper particles
S. V. Dzyubanenkoab, V. D. Luk'yanovab a ITMO University, 49 Kronverkskiy, St. Petersburg, 197101, Russia
b JSC Avangard, St. Petersburg, Russia
Аннотация:
The results of experimental studies for the formation kinetics of an intermetallic compound in the diffusion of gallium in copper are discussed. The mathematical model for the experimental study made it possible to calculate the diffusion coefficient of gallium in copper. A mathematical model for the kinetics of intermetallic compound formation at the reactive diffusion of gallium in a copper particle allows one to estimate the solidification time for diffusion-curing paste-based solder consisting of molten gallium and copper powder.
Ключевые слова:
reactive diffusion, solder, gallium, copper, intermetallic, kinetics.
Поступила в редакцию: 02.12.2014 Исправленный вариант: 18.12.2014
Образец цитирования:
S. V. Dzyubanenko, V. D. Luk'yanov, “Modeling of the kinetics of reactive diffusion of gallium in copper particles”, Наносистемы: физика, химия, математика, 6:3 (2015), 332–345
Образцы ссылок на эту страницу:
https://www.mathnet.ru/rus/nano947 https://www.mathnet.ru/rus/nano/v6/i3/p332
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Страница аннотации: | 58 | PDF полного текста: | 24 |
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