Polybenzimidazole-based thiol-ene photosensitive composition for DLP 3D printing

Aphotosensitive composition based on N-allylated poly[2,2'-(p-oxydiphenylene)-5,5'-dibenzimidazole] and pentaerythritol tetrakis(3-mercaptopropionate) has been developed. This photosensitive composition is capable of forming cross-linked 3D-structures due to UV-initiated thiol-ene polymerization. Using digital light processing 3D printing, 3D-objects with high resolution, mechanical strength and thermal resistance up to 397 °C are formed.