1. |
A. V. Irodova, I. D. Karpov, V. S. Kruglov, V. E. Krylov, S. V. Shavkin, V. T. Em, “Residual stress in the carrier tape AISI 310S at the stage of deposition of the YSZ buffer layer when manufacturing of HTSC-2 wire”, Zhurnal Tekhnicheskoi Fiziki, 91:12 (2021), 1964–1970 |