Memory response on thermoelastic behavior with temperature dependent material moduli under mechanical strip load

Temperature of the medium has a significant impact on the deformation and stress distribution into the medium. Material moduli is another key component that determines the deformation of the structural element. The present paper deals with the thermal memory response on stress and temperature fields in an isotropic medium. The material moduli of the medium are considered to be varying with temperature. Consequently, the classical heat conduction law is replaced by the memory dependent generalized theory of heat conduction. Analytical solutions of the field functions are obtained in the integral transform domain. The variations of the field functions in the space-time coordinate system are displayed graphically for different empirical constants and kernel functions.