Teplofizika vysokikh temperatur
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Teplofizika vysokikh temperatur, 2021, Volume 59, Issue 2, Pages 195–202
DOI: https://doi.org/10.31857/S0040364421020058
(Mi tvt11480)
 

This article is cited in 4 scientific papers (total in 4 papers)

Heat and Mass Transfer and Physical Gasdynamics

Critical outflow of a vapor–liquid flow through a grain layer

D. P. Khramtsovab, B. G. Pokusaevba, D. A. Nekrasovba, A. V. Vyazmina

a MIREA — Russian Technological University, Moscow
b Moscow Polytechnic University
Abstract: Based on previous experimental studies, we carried out a numerical simulation of the process of the critical outflow of a vapor–liquid flow in cylindrical channels filled with a layer of spherical particles. The process is characterized by a sharp boiling up of the liquid and a change in the thermohydraulic properties of the flow. The spherical fillings were particles $2$, $4$, and $8$ mm in diameter, and the layer lengths were $250$ and $355$ mm. The effect of the material and the temperature of the filling on the intensification of vaporization and the profiles of the vapor content over the channel cross section were studied. Data were obtained on the critical flow rate, the speed of sound for various system configurations with respect to the particle diameter, the length of the layer of spherical particles, their material, and the level of the initial vapor content. The speed of sound is estimated for the gasdynamic blocking of a vapor–liquid flow, the values of which are in the region between the thermodynamically equilibrium and the frozen speeds of sound.
Funding agency Grant number
Ministry of Science and Higher Education of the Russian Federation АААА-А20-120092190052-9
The work was supported within the framework of the implementation of the basic part of the state assignment of the Moscow Polytechnic University, project no. AAAA-A20-120092190052-9.
Received: 28.07.2020
Revised: 11.10.2020
Accepted: 14.10.2020
English version:
High Temperature, 2021, Volume 59, Issue 2, Pages 171–177
DOI: https://doi.org/10.1134/S0018151X2102005X
Bibliographic databases:
Document Type: Article
UDC: 532.546.2
Language: Russian
Citation: D. P. Khramtsov, B. G. Pokusaev, D. A. Nekrasov, A. V. Vyazmin, “Critical outflow of a vapor–liquid flow through a grain layer”, TVT, 59:2 (2021), 195–202; High Temperature, 59:2 (2021), 171–177
Citation in format AMSBIB
\Bibitem{KhrPokNek21}
\by D.~P.~Khramtsov, B.~G.~Pokusaev, D.~A.~Nekrasov, A.~V.~Vyazmin
\paper Critical outflow of a vapor--liquid flow through a grain layer
\jour TVT
\yr 2021
\vol 59
\issue 2
\pages 195--202
\mathnet{http://mi.mathnet.ru/tvt11480}
\crossref{https://doi.org/10.31857/S0040364421020058}
\elib{https://elibrary.ru/item.asp?id=45794912}
\transl
\jour High Temperature
\yr 2021
\vol 59
\issue 2
\pages 171--177
\crossref{https://doi.org/10.1134/S0018151X2102005X}
\isi{https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=Publons&SrcAuth=Publons_CEL&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=000776249000026}
\scopus{https://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-85127652000}
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  • https://www.mathnet.ru/eng/tvt/v59/i2/p195
  • This publication is cited in the following 4 articles:
    Citing articles in Google Scholar: Russian citations, English citations
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    Teplofizika vysokikh temperatur Teplofizika vysokikh temperatur
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