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This article is cited in 4 scientific papers (total in 4 papers)
Thermophysical Properties of Materials
Thermal expansion and electrical resistivity of the intermetallic compound $\rm Ti_{67}\rm Al_{33}$
Zh. Kh. Murlievaab, D. K. Palchaeva, M. E. Iskhakova, M. Kh. Rabadanova, U. U. Bagomedovaa a Daghestan State University, Makhachkala
b Daghestan State Institute of National Economy
Abstract:
The thermal expansion coefficient and electrical resistivity are measured simultaneously on the same polycrystalline sample of $\rm Ti_{67}\rm Al_{33}$ in the temperature range of $300$–$1000$ K. The two measured parameters exhibit a qualitative correlation for both the stable and metastable states of the sample. The temperature dependence of the electrical resistivity is shaped by the competition between the semiconductor and metal conductivity mechanisms.
Received: 04.08.2018 Accepted: 25.12.2018
Citation:
Zh. Kh. Murlieva, D. K. Palchaev, M. E. Iskhakov, M. Kh. Rabadanov, U. U. Bagomedova, “Thermal expansion and electrical resistivity of the intermetallic compound $\rm Ti_{67}\rm Al_{33}$”, TVT, 57:2 (2019), 203–206; High Temperature, 57:2 (2019), 182–185
Linking options:
https://www.mathnet.ru/eng/tvt11100 https://www.mathnet.ru/eng/tvt/v57/i2/p203
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Abstract page: | 232 | Full-text PDF : | 116 | References: | 18 |
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