Kvantovaya Elektronika
RUS  ENG    JOURNALS   PEOPLE   ORGANISATIONS   CONFERENCES   SEMINARS   VIDEO LIBRARY   PACKAGE AMSBIB  
General information
Latest issue
Archive
Impact factor
Submit a manuscript

Search papers
Search references

RSS
Latest issue
Current issues
Archive issues
What is RSS



Kvantovaya Elektronika:
Year:
Volume:
Issue:
Page:
Find






Personal entry:
Login:
Password:
Save password
Enter
Forgotten password?
Register


Kvantovaya Elektronika, 1982, Volume 9, Number 8, Pages 1673–1677 (Mi qe5788)  

Structure of growing surfaces of copper–tin alloy films condensing in vacuum

V. V. Apollonov, V. G. Ermolaev, L. T. Kir'yanova, G. A. Kulikova, L. M. Ostrovskaya, V. Yu. Khomich, M. I. Tsypin
Abstract: An experimental investigation was made of the dependence of the microstructure and morphology of the surfaces of copper–tin alloy films on their phase composition, thickness, formation conditions, and heat treatment.
Received: 30.10.1981
English version:
Soviet Journal of Quantum Electronics, 1982, Volume 12, Issue 8, Pages 1070–1073
DOI: https://doi.org/10.1070/QE1982v012n08ABEH005788
Bibliographic databases:
Document Type: Article
UDC: 621.793
PACS: 68.55.+b, 64.70.Hz, 81.30.Bx, 81.40.Gh
Language: Russian


Citation: V. V. Apollonov, V. G. Ermolaev, L. T. Kir'yanova, G. A. Kulikova, L. M. Ostrovskaya, V. Yu. Khomich, M. I. Tsypin, “Structure of growing surfaces of copper–tin alloy films condensing in vacuum”, Kvantovaya Elektronika, 9:8 (1982), 1673–1677 [Sov J Quantum Electron, 12:8 (1982), 1070–1073]
Linking options:
  • https://www.mathnet.ru/eng/qe5788
  • https://www.mathnet.ru/eng/qe/v9/i8/p1673
  • Citing articles in Google Scholar: Russian citations, English citations
    Related articles in Google Scholar: Russian articles, English articles
    Квантовая электроника Quantum Electronics
    Statistics & downloads:
    Abstract page:124
    Full-text PDF :62
    First page:1
     
      Contact us:
     Terms of Use  Registration to the website  Logotypes © Steklov Mathematical Institute RAS, 2024