Kvantovaya Elektronika
RUS  ENG    JOURNALS   PEOPLE   ORGANISATIONS   CONFERENCES   SEMINARS   VIDEO LIBRARY   PACKAGE AMSBIB  
General information
Latest issue
Archive
Impact factor
Submit a manuscript

Search papers
Search references

RSS
Latest issue
Current issues
Archive issues
What is RSS



Kvantovaya Elektronika:
Year:
Volume:
Issue:
Page:
Find






Personal entry:
Login:
Password:
Save password
Enter
Forgotten password?
Register


Kvantovaya Elektronika, 2004, Volume 34, Number 4, Pages 375–380 (Mi qe2683)  

This article is cited in 3 scientific papers (total in 3 papers)

Interaction of laser radiation with matter

Disturbance of adhesion upon ablation of thin filmsby laser pulses

A. V. Fedenev, E. I. Lipatov, V. F. Tarasenko, V. M. Orlovskii, M. A. Shulepov, N. N. Koval', I. M. Goncharenko

Institute of High Current Electronics, Siberian Branch of the Russian Academy of Sciences, Tomsk
Full-text PDF (259 kB) Citations (3)
Abstract: The effect of IR and UV laser pulses on thin metal and composite films on glass substrates as a function of the energy density is studied. Upon irradiation by ~300-ns laser pulses with a nonuniform energy-density distribution over the laser-beam cross section, the characteristic regions can be distinguished on the film surface. The dimensions of these regions correlate with the energy distribution in the beam and correspond to the evaporation, melting, and damage conditions caused by thermal stresses. For a uniform energy-density distribution over the laser-beam cross section and a pulse duration of ~20 ns, the adhesion of metal and composite films to glass was disturbed due to induced thermal stresses without substrate melting. The threshold laser-energy densities required for disturbing the adhesion of titanium, titanium nitride, zirconium, niobium, and stainless-steel films on glass substrates are measured. Numerical estimates of the surface temperature and thermal stresses caused by heating show that the film adhesion to a substrate can be overcome by expending a small fraction of the energy, while most of the energy of thermal stresses goes to the formation of cracks and the kinetic energy of escaping film fragments. It is suggested to use pulsed laser radiation to roughly estimate the adhesion of metal and composite films to glass substrates.
Received: 03.07.2003
Revised: 19.12.2003
English version:
Quantum Electronics, 2004, Volume 34, Issue 4, Pages 375–380
DOI: https://doi.org/10.1070/QE2004v034n04ABEH002683
Bibliographic databases:
Document Type: Article
PACS: 79.20.Ds, 68.35.Np, 68.60.-p
Language: Russian


Citation: A. V. Fedenev, E. I. Lipatov, V. F. Tarasenko, V. M. Orlovskii, M. A. Shulepov, N. N. Koval', I. M. Goncharenko, “Disturbance of adhesion upon ablation of thin filmsby laser pulses”, Kvantovaya Elektronika, 34:4 (2004), 375–380 [Quantum Electron., 34:4 (2004), 375–380]
Linking options:
  • https://www.mathnet.ru/eng/qe2683
  • https://www.mathnet.ru/eng/qe/v34/i4/p375
  • This publication is cited in the following 3 articles:
    Citing articles in Google Scholar: Russian citations, English citations
    Related articles in Google Scholar: Russian articles, English articles
    Квантовая электроника Quantum Electronics
    Statistics & downloads:
    Abstract page:246
    Full-text PDF :139
    First page:1
     
      Contact us:
     Terms of Use  Registration to the website  Logotypes © Steklov Mathematical Institute RAS, 2024