Analysis of thermal conditions of high-power semiconductor lasers and their arrays

The results of thermophysical investigations of semiconductor lasers are reported, which underlie the formulation of the optimal requirements on the materials, design parameters, and technological assembling conditions for high-power semiconductor lasers and their one- and two-dimensional arrays with the goal of most efficient heat removal. The methods are outlined for calculating the residual post-assembling mechanical stress and determining the assemblage conditions under which the attendant stress is insignificant and its effect on the laser quality is minimal. Also the methods are given for calculating the thermal resistance for different heat sinks, including heat sinks with forced cooling, and of determining the design requirements on the heat sink arising from specific service conditions.