Abstract:
A problem of damping vibrations of a smart structure consisting of elastic and viscoelastic materials and piezoelements with connected shunt circuits is considered. It is proposed to replace the classical resistor in the shunt circuit by an element made of an electroconducting material, in particular, a polymer material filled with graphene nanoparticles. This element plays the role of several resistors with different resistance values, which ensure multimodal damping of vibrations. A mathematical formulation of the problem of forced steady and natural vibrations of smart systems under consideration is provided, as well as results of numerical calculations, which show that graphene-based composites can be used for additional damping of vibrations of smart structures based on piezoelements.
Citation:
V. P. Matveenko, D. A. Oshmarin, N. A. Iurlova, “Application of electroconducting composite materials for additional damping of smart systems based on piezoelements”, Prikl. Mekh. Tekh. Fiz., 62:5 (2021), 45–57; J. Appl. Mech. Tech. Phys., 62:5 (2021), 742–751
\Bibitem{MatOshIur21}
\by V.~P.~Matveenko, D.~A.~Oshmarin, N.~A.~Iurlova
\paper Application of electroconducting composite materials for additional damping of smart systems based on piezoelements
\jour Prikl. Mekh. Tekh. Fiz.
\yr 2021
\vol 62
\issue 5
\pages 45--57
\mathnet{http://mi.mathnet.ru/pmtf108}
\crossref{https://doi.org/10.15372/PMTF20210505}
\elib{https://elibrary.ru/item.asp?id=46709898}
\transl
\jour J. Appl. Mech. Tech. Phys.
\yr 2021
\vol 62
\issue 5
\pages 742--751
\crossref{https://doi.org/10.1134/S0021894421050059}
Linking options:
https://www.mathnet.ru/eng/pmtf108
https://www.mathnet.ru/eng/pmtf/v62/i5/p45
This publication is cited in the following 2 articles:
Sergey I. Senashov, Irina L. Savostyanova, Alexander N. Yakhno, “Bending of composite timber”, Siberian Aerospace Journal, 25:1 (2024), 25
A. Kaghazian, A. Hajnayeb, H. M. Sedighi, “Analyzing a bimorph piezoelectric nanoscale actuator under primary-resonance excitation”, J. Appl. Mech. Tech. Phys., 64:2 (2023), 297–307