Pisma v Zhurnal Tekhnicheskoi Fiziki
RUS  ENG    JOURNALS   PEOPLE   ORGANISATIONS   CONFERENCES   SEMINARS   VIDEO LIBRARY   PACKAGE AMSBIB  
General information
Latest issue
Archive
Guidelines for authors

Search papers
Search references

RSS
Latest issue
Current issues
Archive issues
What is RSS



Pisma v Zhurnal Tekhnicheskoi Fiziki:
Year:
Volume:
Issue:
Page:
Find






Personal entry:
Login:
Password:
Save password
Enter
Forgotten password?
Register


Pisma v Zhurnal Tekhnicheskoi Fiziki, 2018, Volume 44, Issue 20, Pages 37–45
DOI: https://doi.org/10.21883/PJTF.2018.20.46804.17335
(Mi pjtf5664)
 

This article is cited in 1 scientific paper (total in 1 paper)

Modeling deformations in multichip packages of NAND memory

M. A. Belyaeva, V. V. Putrolaynena, V. A. Romanenkob

a Petrozavodsk State University
b GS Nanotech, Gusev, Kaliningrad oblast, Russia
Full-text PDF (484 kB) Citations (1)
Abstract: Deformation of NAND memory multichip packages (MCPs) with various thicknesses of substrate and silicon dies have been numerically simulated. The results of calculations are consistent with experimental data and show equivalence of the deformation in single- and multichip packages with the same total thickness of silicon. Analytical relationship between the values of MCP deformation, substrate core thickness, and total thickness of silicon dies is proposed, which agrees quite well with the data of modeling and can be used for preliminary estimation of MCP deformations.
Funding agency Grant number
Ministry of Education and Science of the Russian Federation 14.580.21.0009
Received: 17.04.2018
English version:
Technical Physics Letters, 2018, Volume 44, Issue 10, Pages 919–922
DOI: https://doi.org/10.1134/S1063785018100176
Bibliographic databases:
Document Type: Article
Language: Russian
Citation: M. A. Belyaev, V. V. Putrolaynen, V. A. Romanenko, “Modeling deformations in multichip packages of NAND memory”, Pisma v Zhurnal Tekhnicheskoi Fiziki, 44:20 (2018), 37–45; Tech. Phys. Lett., 44:10 (2018), 919–922
Citation in format AMSBIB
\Bibitem{BelPutRom18}
\by M.~A.~Belyaev, V.~V.~Putrolaynen, V.~A.~Romanenko
\paper Modeling deformations in multichip packages of NAND memory
\jour Pisma v Zhurnal Tekhnicheskoi Fiziki
\yr 2018
\vol 44
\issue 20
\pages 37--45
\mathnet{http://mi.mathnet.ru/pjtf5664}
\crossref{https://doi.org/10.21883/PJTF.2018.20.46804.17335}
\elib{https://elibrary.ru/item.asp?id=36905899}
\transl
\jour Tech. Phys. Lett.
\yr 2018
\vol 44
\issue 10
\pages 919--922
\crossref{https://doi.org/10.1134/S1063785018100176}
Linking options:
  • https://www.mathnet.ru/eng/pjtf5664
  • https://www.mathnet.ru/eng/pjtf/v44/i20/p37
  • This publication is cited in the following 1 articles:
    Citing articles in Google Scholar: Russian citations, English citations
    Related articles in Google Scholar: Russian articles, English articles
    Pisma v Zhurnal Tekhnicheskoi Fiziki Pisma v Zhurnal Tekhnicheskoi Fiziki
    Statistics & downloads:
    Abstract page:37
    Full-text PDF :11
     
      Contact us:
     Terms of Use  Registration to the website  Logotypes © Steklov Mathematical Institute RAS, 2024