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Substrates with diamond heat sink for epitaxial GaN growth
I. O. Mayborodaa, I. A. Chernykha, V. S. Sedovb, A. Altakhovb, A. A. Andreeva, Yu. V. Grishchenkoa, E. M. Kolobkovaa, A. K. Martyanovb, V. I. Konovb, M. L. Zanaveskina a National Research Centre "Kurchatov Institute", Moscow
b Prokhorov General Physics Institute of the Russian Academy of Sciences, Moscow
Abstract:
Silicon wafers with a polycrystalline diamond heat sink have been fabricated; the silicon and diamond layers have thicknesses of 234 nm and 250 $\mu$m, respectively. The diamond thermal conductivity is 1290 $\pm$ 190 W/(m K). Nitride heterostructures with two-dimensional electron gas have been grown on silicon substrates with a polycrystalline diamond heat sink using ammoniacal molecular-beam epitaxy. The electron mobility in the two-dimensional electron gas and its sheet resistance are 1600 cm$^2$/(V s) and 300 $\Omega/\square$, respectively.
Keywords:
high electron mobility transistor, nitride heterostructure, gallium nitride, silicon, diamond.
Received: 25.11.2020 Revised: 16.12.2020 Accepted: 17.12.2020
Citation:
I. O. Mayboroda, I. A. Chernykh, V. S. Sedov, A. Altakhov, A. A. Andreev, Yu. V. Grishchenko, E. M. Kolobkova, A. K. Martyanov, V. I. Konov, M. L. Zanaveskin, “Substrates with diamond heat sink for epitaxial GaN growth”, Pisma v Zhurnal Tekhnicheskoi Fiziki, 47:7 (2021), 13–16; Tech. Phys. Lett., 47:5 (2021), 353–356
Linking options:
https://www.mathnet.ru/eng/pjtf4810 https://www.mathnet.ru/eng/pjtf/v47/i7/p13
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Abstract page: | 88 | Full-text PDF : | 35 |
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