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Study of nitrogen ion implantation through Si$_3$N$_4$ layer for GaN on Si power hemts isolation process
V. I. Egorkina, S. V. Obolenskyb, V. E. Zemlyakova, A. A. Zaitseva, V. I. Garmasha a National Research University of Electronic Technology
b National Research Lobachevsky State University of Nizhny Novgorod
Abstract:
This letter reports a nitrogen ion implantation through silicon nitride passivation layer deposited on AlGaN/GaN on Si heterojunction structure. Employment of Si$_3$N$_4$ layer simplify HEMT fabrication process and helps to obtain high resistivity isolation due to the shift of implanted ions distribution towards the surface of semiconductor. This isolation process in combination with C-doped heterostructure buffer layer results in increased up to 650 V breakdown voltage.
Keywords:
ion implantation, breakdown voltage, GaN, power transistor.
Received: 05.04.2021 Revised: 27.05.2021 Accepted: 04.06.2021
Citation:
V. I. Egorkin, S. V. Obolensky, V. E. Zemlyakov, A. A. Zaitsev, V. I. Garmash, “Study of nitrogen ion implantation through Si$_3$N$_4$ layer for GaN on Si power hemts isolation process”, Pisma v Zhurnal Tekhnicheskoi Fiziki, 47:18 (2021), 15–17
Linking options:
https://www.mathnet.ru/eng/pjtf4676 https://www.mathnet.ru/eng/pjtf/v47/i18/p15
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