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This article is cited in 4 scientific papers (total in 4 papers)
Manufacturing, processing, testing of materials and structures
Electrical activity of extended defects in multicrystalline silicon
S. M. Peshcherovaa, E. B. Yakimovb, A. I. Nepomnyashchikha, L. A. Pavlovaa, O. V. Feklisovab, R. V. Presnyakova a Vinogradov Institute of Geochemistry and Analytical Chemistry, Siberian Branch, Russian Academy of Sciences, Irkutsk, Russia
b Institute of Microelectronics Technology and High-Purity Materials RAS, Chernogolovka, Russia
Abstract:
The excess carrier lifetime $(\tau)$ distribution in multicrystalline silicon grown by the Bridgman technique from high-purity metallurgical silicon (HPMG-Si) is studied. The features of the variation in $\tau$, caused by the grain-boundary structure of ingots, are revealed. The grain boundaries, dislocations, and impurity microinclusions are studied by electron probe microanalysis (EPMA) and scanning electron microscopy (SEM) using selective acid etching. The electrical activity of extended defects is measured by the electronbeam- induced-current (EBIC) method.
Received: 09.02.2017 Accepted: 16.02.2017
Citation:
S. M. Peshcherova, E. B. Yakimov, A. I. Nepomnyashchikh, L. A. Pavlova, O. V. Feklisova, R. V. Presnyakov, “Electrical activity of extended defects in multicrystalline silicon”, Fizika i Tekhnika Poluprovodnikov, 52:2 (2018), 266–271; Semiconductors, 52:2 (2018), 254–259
Linking options:
https://www.mathnet.ru/eng/phts5927 https://www.mathnet.ru/eng/phts/v52/i2/p266
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