Dielectric sol-gel coatings based on silica dioxide for surface planarization of integral microcircuits

The conditions for the formation of sol-gel coatings for surface planarization were investigated depending on the composition of the film-forming solution. The optimal modes of applying a film-forming solution by spin-coating method were determined. The modes of heat treatment of the obtained coatings have been selected experimentally, and the effect of heat treatment on the thickness and continuity of the formed coatings has been established. By the methods of profilometry and scanning probe microscopy the roughness and planarization of the surface of the aluminum metallization of an integrated circuit using the obtained sol-gel coatings have been studied. To analyze the homogeneity of the layer structures of the deposited sol-gel coatings, studies of planarity and thickness were carried out using a scanning electron microscope.