Investigation of the process of laser splitting of two-layer structures of silicon plates and glass substrates

In this work, a numerical simulation of the process of laser splitting of two-layer structures made of monocrystalline silicon and glass is carried out when the workpiece is exposed to laser beams with wavelengths equal to 1.06 $\mu$m and 10.6 $\mu$m and a refrigerant. The calculation of thermoelastic fields formed in a two-layer plate as a result of laser heating was carried out for three sections of silicon crystals: (100), (110), (111). The analysis of the results obtained was carried out both for the case of processing from the side of the glass layer, and for the case of processing from the side of monocrystalline silicon. The results obtained in this work can be used to optimize the process of precision separation of two-layer structures made of monocrystalline silicon and glass.