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Nanosystems: Physics, Chemistry, Mathematics, 2015, Volume 6, Issue 3, Pages 332–345
DOI: https://doi.org/10.17586/2220-8054-2015-6-3-332-345 (Mi nano947) 		 
Modeling of the kinetics of reactive diffusion of gallium in copper particles

S. V. Dzyubanenkoab, V. D. Luk'yanovab

a ITMO University, 49 Kronverkskiy, St. Petersburg, 197101, Russia
b JSC Avangard, St. Petersburg, Russia
Full-text PDF (423 kB)
DOI: https://doi.org/10.17586/2220-8054-2015-6-3-332-345
Abstract: The results of experimental studies for the formation kinetics of an intermetallic compound in the diffusion of gallium in copper are discussed. The mathematical model for the experimental study made it possible to calculate the diffusion coefficient of gallium in copper. A mathematical model for the kinetics of intermetallic compound formation at the reactive diffusion of gallium in a copper particle allows one to estimate the solidification time for diffusion-curing paste-based solder consisting of molten gallium and copper powder.
Keywords: reactive diffusion, solder, gallium, copper, intermetallic, kinetics.
Received: 02.12.2014
Revised: 18.12.2014
Bibliographic databases:
Document Type: Article
PACS: 02.30.Hq; 66.30.-h
Language: English
Citation: S. V. Dzyubanenko, V. D. Luk'yanov, “Modeling of the kinetics of reactive diffusion of gallium in copper particles”, Nanosystems: Physics, Chemistry, Mathematics, 6:3 (2015), 332–345
Citation in format AMSBIB
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\by S.~V.~Dzyubanenko, V.~D.~Luk'yanov
\paper Modeling of the kinetics of reactive diffusion of gallium in copper particles
\jour Nanosystems: Physics, Chemistry, Mathematics
\yr 2015
\vol 6
\issue 3
\pages 332--345
\mathnet{http://mi.mathnet.ru/nano947}
\crossref{https://doi.org/10.17586/2220-8054-2015-6-3-332-345}
\isi{https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=Publons&SrcAuth=Publons_CEL&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000219892200003}
\elib{https://elibrary.ru/item.asp?id=23597178}
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