aLTCS and Department of Mechanics & Aerospace Engineering, College of Engineering, Peking University, Beijing, China bCenter for Applied Physics and Technology, Peking University, Beijing, China cDepartment of Engineering Mechanics, Dalian University of Technology, Dalian, China
Abstract:
The graphite-coated copper nanoparticles were synthesized by the detonation decomposition of a copper-doped emulsion explosive and their structure and chemical composition were characterized by TEM, HRTEM, EDX and XRD analysis.
Document Type:
Article
Language: English
Citation:
N. Luo, K. Liu, X. Li, Zh. Wu, Sh. Wu, L. Ye, Ya. Shen, “Synthesis of Graphite-coated Copper Nanoparticles by the Detonation of a Copper-doped Emulsion Explosive”, Mendeleev Commun., 22:5 (2012), 248–249
Linking options:
https://www.mathnet.ru/eng/mendc2807
https://www.mathnet.ru/eng/mendc/v22/i5/p248
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M. A. Ramazanov, F. V. Hajiyeva, “Copper and copper oxide nanoparticles in polypropylene matrix: synthesis, characterization, and dielectric properties”, Composite Interfaces, 27:11 (2020), 1047
Chongwei An, Penghui Ding, Baoyun Ye, Xiaoheng Geng, Jingyu Wang, “Carbon-coated copper nanoparticles prepared by detonation method and their thermocatalysis on ammonium perchlorate”, AIP Advances, 7:3 (2017)
Kai Wang, Sen Xu, Dabin Liu, Gaowen Cai, “Research on the critical temperature of thermal decomposition for large cartridge emulsion explosives”, Journal of Loss Prevention in the Process Industries, 38 (2015), 199
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V. A. Polukhin, N. A. Vatolin, “Stability and thermal evolution of transition metal and silicon clusters”, Russian Chem. Reviews, 84:5 (2015), 498–539
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V. A. Polukhin, E. D. Kurbanova, A. E. Galashev, “Classification of functional d-metal/graphene interfaces according to a sorption mechanism and the resistance to thermoactivated disordering and melting. MD simulation”, Russ. Metall., 2014:8 (2014), 633
N. Luo, T. Chen, K. Liu, Ya. Shen, “Synthesis of High-quality Graphite-coated Iron Composite Nanoparticles by a Rapid Gas-phase Chemical Reaction”, Mendeleev Commun., 23:3 (2013), 153–154
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