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This article is cited in 5 scientific papers (total in 5 papers)
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Influence of grain boundaries on the electrical conductivity of copper alloys
R. G. Chembarisova Ufa State Aviation Technical University
Abstract:
The experimentally found insensitivity of the resistivity of Cu–Cr and Cu–Cr–Zr alloys to structural modifications in alloy specimens subjected to severe plastic deformation has been studied by analytical modeling methods. Using Cu–1.8 wt% Cr–0.8 wt% Zr alloy as an example, it has been shown that an increased contribution of grain boundaries and secondary phase fine particles precipitated after equal channel angular pressing make an increased contribution to resistivity but this increase is compensated for by roughly the same decrease in the contribution from alloying atoms dissolved in the matrix.
Keywords:
copper alloys, resistivity, ultrafine-grained state, grain boundaries, particles of secondary phases.
Received: 01.07.2019 Revised: 01.07.2019 Accepted: 21.10.2019
Citation:
R. G. Chembarisova, “Influence of grain boundaries on the electrical conductivity of copper alloys”, Zhurnal Tekhnicheskoi Fiziki, 90:4 (2020), 618–626; Tech. Phys., 65:4 (2020), 593–601
Linking options:
https://www.mathnet.ru/eng/jtf5337 https://www.mathnet.ru/eng/jtf/v90/i4/p618
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Abstract page: | 45 | Full-text PDF : | 53 |
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