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Zhurnal Tekhnicheskoi Fiziki, 2020, Volume 90, Issue 10, Pages 1750–1757
DOI: https://doi.org/10.21883/JTF.2020.10.49809.315-19
(Mi jtf5190)
 

This article is cited in 4 scientific papers (total in 4 papers)

Solid-State Electronics

Physical and technological characteristic features of the process of installation of dies onto a temporary foundation in internal wiring technology

D. V. Vertyanova, N. E. Korobovaa, A. V. Pogudkina, V. D. Kravtsovab

a National Research University of Electronic Technology
b Bekturov Institute of Chemical Sciences, Almaty
Full-text PDF (830 kB) Citations (4)
Abstract: The physical and technological characteristic features of the installation of dies onto a temporary foundation in the internal wiring technology are studied. The justified selection of the material for the fixation of silicon dies active side down onto a temporary foundation from various solutions of polyamic acids (PAAs) is performed. The experimental dependence of the adhesion strength of silicon dies on the lifetime of the solutions of PAAs is found. The possible defects formed upon the imidization of PAAs in the process of creation of highly integrated microassemblies, multidie modules, and electronic modules of the “system in package” level are shown.
Keywords: technology, internal mounting, polyimide, defects, module.
Funding agency Grant number
State support from the centers of National Technological Initiative 9/1251/2019
The source of funding for this work was agreement no. 9/1251/2019 on the provision of a grant for state support from the centers of National Technological Initiative based on educational higher education institutions and scientific establishments.
Received: 11.09.2019
Revised: 13.02.2020
Accepted: 18.02.2020
English version:
Technical Physics, 2020, Volume 65, Issue 10, Pages 1677–1684
DOI: https://doi.org/10.1134/S1063784220100230
Bibliographic databases:
Document Type: Article
Language: Russian
Citation: D. V. Vertyanov, N. E. Korobova, A. V. Pogudkin, V. D. Kravtsova, “Physical and technological characteristic features of the process of installation of dies onto a temporary foundation in internal wiring technology”, Zhurnal Tekhnicheskoi Fiziki, 90:10 (2020), 1750–1757; Tech. Phys., 65:10 (2020), 1677–1684
Citation in format AMSBIB
\Bibitem{VerKorPog20}
\by D.~V.~Vertyanov, N.~E.~Korobova, A.~V.~Pogudkin, V.~D.~Kravtsova
\paper Physical and technological characteristic features of the process of installation of dies onto a temporary foundation in internal wiring technology
\jour Zhurnal Tekhnicheskoi Fiziki
\yr 2020
\vol 90
\issue 10
\pages 1750--1757
\mathnet{http://mi.mathnet.ru/jtf5190}
\crossref{https://doi.org/10.21883/JTF.2020.10.49809.315-19}
\elib{https://elibrary.ru/item.asp?id=44154133}
\transl
\jour Tech. Phys.
\yr 2020
\vol 65
\issue 10
\pages 1677--1684
\crossref{https://doi.org/10.1134/S1063784220100230}
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  • https://www.mathnet.ru/eng/jtf/v90/i10/p1750
  • This publication is cited in the following 4 articles:
    Citing articles in Google Scholar: Russian citations, English citations
    Related articles in Google Scholar: Russian articles, English articles
    Zhurnal Tekhnicheskoi Fiziki Zhurnal Tekhnicheskoi Fiziki
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