|
This article is cited in 3 scientific papers (total in 3 papers)
Physical electronics
A study of ultrathin superconducting films of niobium nitride obtained by atomic layer deposition
M. V. Shibalov, N. V. Porokhov, A. M. Mymlyakov, I. V. Trofimov, G. D. Diudbin, E. R. Timofeeva, A. M. Tagachenkov, Yu. V. Anufriev, E. V. Zenova, M. A. Tarkhov Institute of Nanotechnologies of Microelectronics, Russian Academy of Sciences, Moscow, Russia
Abstract:
A method is presented for the deposition of ultrathin superconducting NbN$_x$ films by atomic layer deposition enhanced by plasma from an organometallic precursor and an H$_2$/Ar gas mixture used as a reactant. The samples obtained are characterized by measurements of resistivity, spectral ellipsometry, atomic force microscopy, and measurements of superconducting characteristics. The optimal parameters of the H$_2$/Ar gas ratio are determined at which the resistivity of the NbN$_x$ films is minimal. A comparative analysis of the resistivity of the obtained NbN$_x$ films is carried out. The dependence of the temperature of transition to the superconducting state on film thickness is investigated. A transition temperature of 13.7 K and a critical current density of 0.7 MA/cm$^2$ are reached. The high film uniformity, precision control of the thickness, and deposition temperature of 350$^\circ$C make it possible to use these films in the production of field-effect transistors and in functional devices for various purposes, for example, in hot-electron bolometers, kinetic inductance detectors, and superconducting single-photon detectors.
Keywords:
atomic layer deposition, superconductor, niobium nitride, critical temperature, critical current density.
Received: 08.09.2020 Revised: 19.10.2020 Accepted: 06.11.2020
Citation:
M. V. Shibalov, N. V. Porokhov, A. M. Mymlyakov, I. V. Trofimov, G. D. Diudbin, E. R. Timofeeva, A. M. Tagachenkov, Yu. V. Anufriev, E. V. Zenova, M. A. Tarkhov, “A study of ultrathin superconducting films of niobium nitride obtained by atomic layer deposition”, Zhurnal Tekhnicheskoi Fiziki, 91:4 (2021), 672–677; Tech. Phys., 66:5 (2021), 658–663
Linking options:
https://www.mathnet.ru/eng/jtf5044 https://www.mathnet.ru/eng/jtf/v91/i4/p672
|
|