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Pis'ma v Zhurnal Èksperimental'noi i Teoreticheskoi Fiziki, 2020, Volume 111, Issue 8, Pages 514–519
DOI: https://doi.org/10.31857/S1234567820080066
(Mi jetpl6153)
 

CONDENSED MATTER

Comparison of spectra of grain boundaries spontaneously formed in Cu–Ag and Cu–In systems

A. B. Straumala, K. V. Tsoia, I. A. Mazilkinab, A. O. Rodinb, G. Eggelerc

a Institute of Solid State Physics, Russian Academy of Sciences, Chernogolovka, Moscow region, 142432 Russia
b National University of Science and Technology MISiS, Moscow, 119049 Russia
c Ruhr-Universitát Bochum, 44801 Bochum, Germany
References:
Abstract: Spectra of grain boundaries existing in the polycrystalline copper-silver system (positive enthalpy of mixing) have been studied in comparison with those of the copper-indium system (negative enthalpy of mixing). Spectra of grain boundaries are formed spontaneously upon an increase in the temperature, occurrence of eutectic and peritectic reactions, and subsequent relaxation of structures in the two-phase solid/liquid region of phase diagrams. It has been shown that the rate of grain growth and the relation between different grain boundary types in the total spectrum depend on the enthalpy of mixing.
Funding agency Grant number
Russian Foundation for Basic Research 18-33-00473
This work was supported by the Russian Foundation for Basic Research (project no. 18-33-00473).
Received: 04.03.2020
Revised: 19.03.2020
Accepted: 19.03.2020
English version:
Journal of Experimental and Theoretical Physics Letters, 2020, Volume 111, Issue 8, Pages 447–451
DOI: https://doi.org/10.1134/S0021364020080111
Bibliographic databases:
Document Type: Article
Language: Russian
Citation: A. B. Straumal, K. V. Tsoi, I. A. Mazilkin, A. O. Rodin, G. Eggeler, “Comparison of spectra of grain boundaries spontaneously formed in Cu–Ag and Cu–In systems”, Pis'ma v Zh. Èksper. Teoret. Fiz., 111:8 (2020), 514–519; JETP Letters, 111:8 (2020), 447–451
Citation in format AMSBIB
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\paper Comparison of spectra of grain boundaries spontaneously formed in Cu–Ag and Cu–In systems
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\pages 514--519
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