Abstract:
A model of heat transport from an insulator (diamond) to a metal (copper) has been proposed taking into account energy transport to the oscillations inherent in the insulator but having frequencies much higher than the frequencies inherent in the fundamental oscillations of the metal. This problem is solved exactly in the one-dimensional case and in the one-constant approximation of bonding at the interface. It has been established that energy transport occurs in a thin layer near the metal boundary.
Citation:
A. P. Meilakhs, E. D. Èidel'man, “New model of heat transport across the metal-insulator interface by the example of boundaries in a diamond-copper composite”, Pis'ma v Zh. Èksper. Teoret. Fiz., 97:1 (2013), 42–44; JETP Letters, 97:1 (2013), 38–40
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\paper New model of heat transport across the metal-insulator interface by the example of boundaries in a diamond-copper composite
\jour Pis'ma v Zh. \`Eksper. Teoret. Fiz.
\yr 2013
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\issue 1
\pages 42--44
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\jour JETP Letters
\yr 2013
\vol 97
\issue 1
\pages 38--40
\crossref{https://doi.org/10.1134/S0021364013010050}
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Linking options:
https://www.mathnet.ru/eng/jetpl3325
https://www.mathnet.ru/eng/jetpl/v97/i1/p42
This publication is cited in the following 11 articles:
A.P. Meilakhs, Annals of Physics, 466 (2024), 169686
E. D. Eidelman, Phys. Usp., 64:6 (2021), 535–557
Meilakhs A., Semak B., Phys. Status Solidi B-Basic Solid State Phys., 258:8 (2021), 2100018, 2100018
Ch. Zhang, Zh. Cai, Y. Tang, R. Wang, Ch. Peng, Ya. Feng, Diam. Relat. Mat., 86 (2018), 98–108
R. Mostallino, M. Garcia, A. Larrue, Y. Robert, E. Vinet, M. Lecomte, O. Parillaud, M. Krakowski, Y. Deshayes, L. Bechou, 2017 IEEE 67Th Electronic Components and Technology Conference (Ectc 2017), Electronic Components and Technology Conference, IEEE, 2017, 563–574
E. D. Eidelman, Semiconductors, 51:7 (2017), 906–908