Study of adhesion properties in sintered layers of silver pastes

Background. Reliability of power semiconductor devices can be improved by a technology of bonding its components using silver-containing pastes (SP). The purpose of this paper is to study the influence of SP sintering modes on the adhesion strength of these bondings. Results. With application of L-peel test and REM the authors investigated the impact of compaction temperature and pressure on the adhesive strength of an SP layer being in contact with a molybdenum temperature compensator and a testing strip. Conclusions. Adhesion properties of the SP sintered layer on the surface of the molybdenum temperature compensator depend on the even distribution of the paste coating and the evenness of pressure compaction. The adhesion strength of bondings is maximum if the process of low temperature SP sintering is carried out at the highest values of pressure and temperature in the given variation range of the said values.