Abstract:
The paper presents a new etching-free technology for the formation of planar superconductor structures based on YBCO films with metal contacts. The required topology of superconducting elements from YBCO film is created by the proposed “preliminary topology mask” method. The ohmic contacts to the superconducting structure are produced by lift-off photolithography. In order to study the capabilities of this technology, measurements of superconducting bridges with a width of 3, 10, and 50 μm and test structures for measuring the contact resistance are performed.
Citation:
D. V. Masterov, S. A. Pavlov, A. E. Parafin, “A new approach to formation of the topology of planar structures on the basis of a YBCO high-temperature superconductor”, Fizika Tverdogo Tela, 59:11 (2017), 2113–2116; Phys. Solid State, 59:11 (2017), 2133–2136
\Bibitem{MasPavPar17}
\by D.~V.~Masterov, S.~A.~Pavlov, A.~E.~Parafin
\paper A new approach to formation of the topology of planar structures on the basis of a YBCO high-temperature superconductor
\jour Fizika Tverdogo Tela
\yr 2017
\vol 59
\issue 11
\pages 2113--2116
\mathnet{http://mi.mathnet.ru/ftt9386}
\crossref{https://doi.org/10.21883/FTT.2017.11.45046.05k}
\elib{https://elibrary.ru/item.asp?id=30554671}
\transl
\jour Phys. Solid State
\yr 2017
\vol 59
\issue 11
\pages 2133--2136
\crossref{https://doi.org/10.1134/S1063783417110221}
Linking options:
https://www.mathnet.ru/eng/ftt9386
https://www.mathnet.ru/eng/ftt/v59/i11/p2113
This publication is cited in the following 3 articles:
Sumalin Phokha, Saksorn Limwichean, Mati Horprathum, Viyapol Patthanasettakul, Chanunthorn Chananonnawathorn, Pitak Eiamchai, Narong Chanlek, Santi Maensiri, “Effect of annealing temperature on the structural and magnetic properties of CeO2 thin films”, Thin Solid Films, 704 (2020), 138001
Leonid S. Revin, Andrey L. Pankratov, Dmitry V. Masterov, Alexey E. Parafin, Sergey A. Pavlov, Alexander V. Chiginev, Evgeny V. Skorokhodov, “Features of Long YBCO Josephson Junctions Fabricated by Preliminary Topology Mask”, IEEE Trans. Appl. Supercond., 28:7 (2018), 1