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Numerical analysis of semiconductor thermocouple operation in recording exothermic processes in a recovery capsule
S. S. Nabatov, A. V. Kul'bachevskii, A. V. Lebedev Institute of Problems of Chemical Physics, Russian Academy of Sciences, Chernogolovka, Moscow region
Abstract:
Numerical simulation is used to analyze the operation of a semiconductor tin-monosulfide thermocouple. The element is used to record exothermic processes in shock-recovery experiments. We solved the problem in a one-dimensional formulation by considering a multilayer scheme that models the location of the sample and the thermocouple inside a real flat capsule. Numerical calculations yield time dependences of the thermal electromotive force (EMF) at various heat-release rates in the substance under study.
Received: 13.06.1995
Citation:
S. S. Nabatov, A. V. Kul'bachevskii, A. V. Lebedev, “Numerical analysis of semiconductor thermocouple operation in recording exothermic processes in a recovery capsule”, Fizika Goreniya i Vzryva, 32:4 (1996), 120–127; Combustion, Explosion and Shock Waves, 32:4 (1996), 460–465
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https://www.mathnet.ru/eng/fgv2696 https://www.mathnet.ru/eng/fgv/v32/i4/p120
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