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Computer Research and Modeling, 2014, Volume 6, Issue 3, Pages 397–403
DOI: https://doi.org/10.20537/2076-7633-2014-6-3-397-403
(Mi crm330)
 

MODELS IN PHYSICS AND TECHNOLOGY

Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes

V. M. Karabana, M. P. Sukhorukova, E. A. Morozovb

a Tomsk state university of control systems and radioelectronics, 40 Lenin avenue, Tomsk, Russia, 634050
b The Joint-stock Company Academician M. F. Reshetnev «Information Satellite Systems», 52 Lenin St., Zheleznogorsk, Krasnoyarsk region, 662972, Russia
References:
Abstract: In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-temperature ceramics for autonomous navigation systems. And also provides a comparison with the results of certified software product.
Keywords: multilayer integrated circuits, low-temperature co-fired ceramic, thermal conditions, space equipment, mathematical modeling, and differential equations.
Funding agency Grant number
Ministry of Education and Science of the Russian Federation 02.G25.31.0042
Received: 23.04.2014
Revised: 22.05.2014
Document Type: Article
UDC: 519.688
Language: Russian
Citation: V. M. Karaban, M. P. Sukhorukov, E. A. Morozov, “Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes”, Computer Research and Modeling, 6:3 (2014), 397–403
Citation in format AMSBIB
\Bibitem{KarSukMor14}
\by V.~M.~Karaban, M.~P.~Sukhorukov, E.~A.~Morozov
\paper Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes
\jour Computer Research and Modeling
\yr 2014
\vol 6
\issue 3
\pages 397--403
\mathnet{http://mi.mathnet.ru/crm330}
\crossref{https://doi.org/10.20537/2076-7633-2014-6-3-397-403}
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