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MODELS IN PHYSICS AND TECHNOLOGY
Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes
V. M. Karabana, M. P. Sukhorukova, E. A. Morozovb a Tomsk state university of control systems and radioelectronics, 40 Lenin avenue, Tomsk, Russia, 634050
b The Joint-stock Company Academician M. F. Reshetnev «Information Satellite Systems», 52 Lenin St., Zheleznogorsk, Krasnoyarsk region, 662972, Russia
Abstract:
In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-temperature ceramics for autonomous navigation systems. And also provides a comparison with the results of certified software product.
Keywords:
multilayer integrated circuits, low-temperature co-fired ceramic, thermal conditions, space equipment, mathematical modeling, and differential equations.
Received: 23.04.2014 Revised: 22.05.2014
Citation:
V. M. Karaban, M. P. Sukhorukov, E. A. Morozov, “Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes”, Computer Research and Modeling, 6:3 (2014), 397–403
Linking options:
https://www.mathnet.ru/eng/crm330 https://www.mathnet.ru/eng/crm/v6/i3/p397
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Abstract page: | 137 | Full-text PDF : | 72 | References: | 27 |
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