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Computer Optics, 2019, Volume 43, Issue 3, Pages 507–511
DOI: https://doi.org/10.18287/2412-6179-2019-43-3-507-511
(Mi co671)
 

This article is cited in 1 scientific paper (total in 1 paper)

SHORT MESSAGE

The use of atomic force microscopy to assess the quality of cleaning and tribometric properties of a silicon wafer surface

I. D. Mikheev, F. Kh. Vakhitov

Kazan National Research Technical University n.a. A.N. Tupolev – KAI, Kazan, Russia
Full-text PDF (335 kB) Citations (1)
References:
Abstract: Differences in the values of adhesive forces of interaction between the probe tip of an atomic force microscope and the cleaned surfaces of silicon wafers during their treatment with isopropyl alcohol and distilled water were investigated experimentally. It was shown that the presence of water molecules on the surface of the substrates leads to a significant (approximately 5 times) change in the value of these forces. It was found that the use of AFM allows the relative magnitude of friction forces in small areas of silicon wafer surfaces to be estimated.
Keywords: atomic force microscopy, silicon wafers, tribometric properties.
Received: 18.06.2018
Accepted: 09.04.2019
Document Type: Article
Language: Russian
Citation: I. D. Mikheev, F. Kh. Vakhitov, “The use of atomic force microscopy to assess the quality of cleaning and tribometric properties of a silicon wafer surface”, Computer Optics, 43:3 (2019), 507–511
Citation in format AMSBIB
\Bibitem{MikVak19}
\by I.~D.~Mikheev, F.~Kh.~Vakhitov
\paper The use of atomic force microscopy to assess the quality of cleaning and tribometric properties of a silicon wafer surface
\jour Computer Optics
\yr 2019
\vol 43
\issue 3
\pages 507--511
\mathnet{http://mi.mathnet.ru/co671}
\crossref{https://doi.org/10.18287/2412-6179-2019-43-3-507-511}
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  • This publication is cited in the following 1 articles:
    Citing articles in Google Scholar: Russian citations, English citations
    Related articles in Google Scholar: Russian articles, English articles
    Computer Optics
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    References:22
     
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