|
This article is cited in 1 scientific paper (total in 1 paper)
Thermomechanical effects of radiation origin in microelectronics products
Yu. A. Volkova, M. Yu. Vyrostkovb, M. B. Markova, I. A. Tarakanova a Keldysh Institute for Applied Mathematics of RAS
b National Research University «Moscow Power Engineering Institute»
Abstract:
A mathematical model of the thermomechanical effect of penetrating radiation on a microelectronic product is presented. The model is based on the thermoelasticity equations, which are a consequence of the quantum kinetic equations for phonons. Heat transport is described by the law of conservation of energy and the Cattaneo equation, which takes into account the finite rate of heat propagation. Lattice vibrations are considered in the approximation of the linear theory of elasticity. In general, the model determines the distribution of temperature, energy flow, deformation and stress. Difference schemes have been developed for solving the model equations. The effectiveness of the developed model was tested by solving the problem of thermal shock.
Keywords:
penetrating radiation, thermomechanical effect, thermoelasticity, phonons, thermal conductivity, difference scheme, thermal shock.
Received: 16.09.2021 Revised: 16.09.2021 Accepted: 08.11.2021
Citation:
Yu. A. Volkov, M. Yu. Vyrostkov, M. B. Markov, I. A. Tarakanov, “Thermomechanical effects of radiation origin in microelectronics products”, Mat. Model., 34:2 (2022), 58–70; Math. Models Comput. Simul., 14:5 (2022), 727–735
Linking options:
https://www.mathnet.ru/eng/mm4354 https://www.mathnet.ru/eng/mm/v34/i2/p58
|
Statistics & downloads: |
Abstract page: | 217 | Full-text PDF : | 88 | References: | 39 | First page: | 5 |
|